Semiconductor device and method for forming the same

ABSTRACT

A semiconductor device includes a stacked structure on a substrate. The stacked structure includes stepped regions and a central region between the stepped regions, an upper insulation layer on the stacked structure, and a capping insulation layer on the stepped regions of the stacked structure. The capping insulation layer includes a first upper end portion and a second upper end portion that are adjacent to the upper insulation layer. The upper insulation layer is between the first upper end portion and the second upper end portion. The first upper end portion and the second upper end portion extends a first height relative to the substrate that is different from a second height relative to the substrate of the second upper end portion.

CROSS-REFERENCE TO RELATED APPLICATION

This US non-provisional patent application is a continuation of U.S.patent application Ser. No. 16/433,218, filed Jun. 6, 2019, which itselfclaims benefit of priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2018-0112457 filed on Sep. 19, 2018 in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

BACKGROUND

The present disclosure relates to a semiconductor device, in particular,a planarization method of a capping insulation layer, a method forforming a semiconductor device using the same, and a semiconductordevice formed thereby.

In order to improve the degree of integration of semiconductor devices,semiconductor devices including gates that are stacked while beingspaced apart from each other in a direction perpendicular to an uppersurface of the semiconductor substrates have been developed. As thenumber of stacked gates increases, unexpected failures may occur in theprocess, making it difficult to improve the productivity of thesemiconductor devices.

SUMMARY

An aspect of the present inventive concept is to provide a method offorming a semiconductor device capable of improving the degree ofplanarization of a capping insulation layer surrounding a stackedstructure.

An aspect of the present inventive concept is to provide a methodcapable of improving the degree of integration of a semiconductordevice.

An aspect of the present inventive concept is to provide a methodcapable of improving productivity in the manufacturing of asemiconductor device.

Some embodiments of the present inventive concepts provide asemiconductor device. The semiconductor device includes a stackedstructure on a substrate. The stacked structure includes stepped regionsand a central region between the stepped regions, an upper insulationlayer on the stacked structure, and a capping insulation layer on thestepped regions of the stacked structure. The capping insulation layerincludes a first upper end portion and a second upper end portion thatare adjacent to the upper insulation layer. The upper insulation layeris between the first upper end portion and the second upper end portion.The first upper end portion and the second upper end portion extends afirst height relative to the substrate that is different from a secondheight relative to the substrate of the second upper end portion.

According to some embodiments of the present inventive concepts, asemiconductor device is provided. The semiconductor device includesstacked structures on a substrate, and spaced apart from each other.Each of the stacked structures include a central region and a steppedregion surrounding the central region, upper insulation layers on thestacked structures, and a capping insulation layer surrounding the upperinsulation layers. The capping insulation layers is on the steppedregions of the stacked structures and between the stacked structures.The capping insulation layer includes upper end portions adjacent to theupper insulation layers and having different heights relative to thesubstrate.

According to some embodiments of the present inventive concepts, asemiconductor device is provided. The semiconductor device includesseparation structures on a substrate, a protrusion structure between theseparation structures. The protrusion structure includes a stackedstructure and an upper insulation layer on the stacked structure. Thestacked structure includes stepped regions and a central region betweenthe stepped regions, and a capping insulation layer on the steppedregions and adjacent to the upper insulation layer. The cappinginsulation layer comprises a first upper end portion and a second upperend portion that are adjacent to the upper insulation layer and havedifferent heights relative to the substrate.

According to some embodiments of the present inventive concept, a methodfor forming a semiconductor device is provided. The method includesforming protrusion structures on a substrate, wherein each of theprotrusion structures includes a molded structure, an upper insulationlayer on the molded structure, and a planarization stop layer on theupper insulation layer, forming a capping insulation layer on thesubstrate having the protrusion structures; forming a mask patternhaving openings on the capping insulation layer, wherein the openingsoverlap the protrusion structures, etching the capping insulation layerexposed by the openings; removing the mask pattern after etching thecapping insulation layer, after the mask pattern is removed, a firstplanarization process for first planarizing the capping insulation layeris performed; after the first planarization process, a secondplanarization process for second planarizing the capping insulationlayer is performed to form a planarized capping insulation layer; andremoving the planarization stop layers of the protrusion structures toexpose the upper insulation layers. The planarized capping insulationlayer has upper end portions adjacent to the planarization stop layers,the upper end portions includes first and second upper end portionspositioned on different height levels.

According to some embodiments of the present inventive concept, a methodfor forming a semiconductor device is provided. The method includesforming protrusion structures on a substrate, wherein each of theprotrusion structures includes a molded structure including a centralregion and a stepped region surrounding the central region, an upperinsulation layer on the central region of the molded structure, and aplanarization stop layer on the upper insulation layer, forming acapping insulation layer on the substrate having the protrusionstructures, forming a mask pattern having openings on the cappinginsulation layer, wherein the openings overlap the central regions ofthe protrusion structures, etching the capping insulation layer exposedby the openings, removing the mask pattern after etching the cappinginsulation layer, after the mask pattern is removed, performing a firstplanarization process for first planarizing the capping insulationlayer; after the first planarization process, performing a secondplanarization process for second planarizing the capping insulationlayer to form a planarized capping insulation layer, and removing theplanarization stop layers of the protrusion structures to expose theupper insulation layers. The openings have a smaller size than theplanarization stop layers of the protrusion structures, the openingsinclude openings having different widths or sizes from each other.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIGS. 1A and 1B are flowcharts illustrating a method of forming asemiconductor device according to some embodiments of the presentinventive concepts;

FIG. 2 is a plan view illustrating a method of forming a semiconductordevice according to some embodiments of the present inventive concepts;

FIG. 3 is a partially enlarged view of a portion of FIG. 2;

FIGS. 4A to 15B are views illustrating methods of forming asemiconductor device according to some embodiments of the presentinventive concepts;

FIG. 16 is a partially enlarged cross-sectional view illustrating aportion of a semiconductor device according to some embodiments of thepresent inventive concepts;

FIG. 17 is a partially enlarged cross-sectional view illustrating aportion of a semiconductor device according to some embodiments of thepresent inventive concepts;

FIG. 18 is a cross-sectional view illustrating modified embodiments of asemiconductor device according to some embodiments of the presentinventive concepts; and

FIG. 19 is a plan view illustrating a semiconductor device according tosome embodiments of the present inventive concepts.

DETAILED DESCRIPTION

It is noted that aspects of the inventive concepts described withrespect to one embodiment, may be incorporated in a different embodimentalthough not specifically described relative thereto. That is, allembodiments and/or features of any embodiment can be combined in any wayand/or combination. These and other objects and/or aspects of thepresent inventive concepts are explained in detail in the specificationset forth below. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of elements and do not modify the individual elements of thelist. Hereinafter, example embodiments of the present inventive conceptswill be described with reference to the accompanying drawings.

Hereinafter, various embodiments of a method of forming a semiconductordevice according to some embodiments of the present inventive conceptswill be described with reference to FIGS. 1A to 19. FIGS. 1A and 1B areflowcharts illustrating a method of forming a semiconductor deviceaccording to some embodiments of the present inventive concepts. FIG. 2is a plan view illustrating a method of forming a semiconductor deviceaccording to some embodiments of the present inventive concepts. FIG. 3is a partially enlarged view of a portion of FIG. 2. FIGS. 4A to 15B areviews illustrating methods of forming a semiconductor device accordingto some embodiments of the present inventive concepts. FIG. 16 is apartially enlarged cross-sectional view illustrating a portion of asemiconductor device according to some embodiments of the presentinventive concepts. FIG. 17 is a partially enlarged cross-sectional viewillustrating a portion of a semiconductor device according to someembodiments of the present inventive concepts. FIG. 18 is across-sectional view illustrating modified embodiments of asemiconductor device according to some embodiments of the presentinventive concepts. FIG. 19 is a plan view illustrating a semiconductordevice according to some embodiments of the present inventive concepts.

In FIGS. 4A to 15B, FIGS. 4A, 5A, 6A, 7A, 8A, 10A, 12A, 13A, and 15A arecross-sectional views illustrating regions taken along a line I-I′ inFIG. 3, FIGS. 4B, 5B, 6B, 7B, 8B, 10B, 12B, 13B, and 15B arecross-sectional views illustrating regions taken along a line I-I′ inFIG. 3, FIG. 9 is a partially enlarged cross-sectional view illustratingmodified embodiments of a method of forming a semiconductor deviceaccording to some embodiments of the present inventive concepts, andFIG. 14 is a partially enlarged plan view illustrating an example of amethod of forming a semiconductor device according to some embodimentsof the present inventive concepts.

Referring to FIGS. 1A, 2, 3, 4A, and 4B, protrusion structures PA may beformed on a substrate 10 (S5). The substrate 10 may be a semiconductorwafer. The substrate 10 may include a plurality of shot areas SA throughwhich light from the exposure apparatus may be irradiated to perform alight exposure process. Each of the shot areas SA may include aplurality of chip areas CA. The protrusion structures PA may be formedon the substrate 10. The protrusion structures PA may be formed in eachof the chip areas CA.

The protrusion structures PA formed on the substrate 10 may be disposedsuch that a distance in a first direction X and a distance in a seconddirection Y are different in one chip area CA. It will be understoodthat, although the terms first, second, third, etc. may be used hereinto describe various elements, and elements should not be limited bythese terms. Rather, these terms are only used to distinguish oneelement from another element. Thus, a first element discussed could betermed a second element without departing from the scope of the presentinventive concepts.

Each of the protrusion structures PA may include a central region CR anda stepped region SR. Formation of the protrusion structures PA mayinclude forming interlayer insulation layers 14 and gate layers 16 thatare alternately and repeatedly stacked on the substrate 10, forming anupper insulation layer 18 and a planarization stop 20 in sequence, andpatterning the planarization stop layer 20, the upper insulation layer18, the interlayer insulation layers 14, and the gate layers 16. Theplanarization stop layer 20 and the upper insulation layer 18 may remainin the central region CR. The interlayer insulation layers 14 and thegate layers 16 may be alternately and repeatedly stacked in the centralregion CR, and extend into the stepped region SR to remain in a shapehaving a stepped structure within the stepped region SR. The interlayerinsulation layers 14 and the gate layers 16 may constitute a moldedstructure 12. Therefore, each of the protrusion structures PA mayinclude the molded structure 12, and the upper insulation layer 18 andthe planarization stop layer 20 which are stacked on the moldedstructure 12 in sequence.

The interlayer insulation layers 14 may be formed of silicon oxide.

In some embodiments, the gate layers 16 may be formed of an insulatingmaterial having an etch selectivity with the interlayer insulationlayers 14, e.g., silicon nitride.

In some embodiments, the gate layers 16 may be formed of a conductivematerial having etch selectivity with the interlayer insulation layers14, e.g., one or more of doped polysilicon, a metal nitride (e.g., TiN),a metal-semiconductor compound (e.g., TiSi, WSi, etc.), and a metal(e.g., W), or a combination thereof.

A capping insulation layer 24 may be formed on the substrate having theprotrusion structures PA (S10). The capping insulation layer 24 may beformed of silicon oxide, or a porous oxide, having a density lower thanthat of the upper insulation layer 18. For example, the cappinginsulation layer 24 may be formed of a low-k dielectric. The cappinginsulation layer 24 may include an oxide formed by a flowable CVD or aSpin On Glass (SOG) having a higher deposition rate or a higherdeposition rate than the upper insulation layer 18. The upper insulationlayer 18 may be formed of silicon oxide, e.g., TEOS oxide.

The capping insulation layer 24 may be formed to have a curved shape bya step difference of the protrusion structures PA. For example, an uppersurface of the capping insulation layer 24 may include protrusionsurfaces 24P protruding in the central regions CR of the protrusionstructures PA in an upward direction, a recessed surface 24R positionedon the substrate between the protrusion structures PA, and an inclinedsurface 24S between the protrusion surfaces 24P and the recessed surface24R. The recessed surface 24R of the upper surface of the cappinginsulation layer 24 may be higher than height of an upper surface of theplanarization stop layer 20 of the protrusion structures PA.

In some embodiments, ‘height’ or ‘height level’ may be defined based onan upper surface 10 s of the substrate 10. For example, the same heightlevel may refer to being positioned at the same height from the uppersurface 10 s of the substrate 10 in a vertical direction Z. The verticaldirection Z may be perpendicular to the upper surface 10 s of thesubstrate 10.

The shot areas SA may include a first shot area SA1 and a second shotarea SA2 that are adjacent to each other. The plurality of chip areas CAin the first shot area SA1 may include a first chip area CA1 and asecond chip area CA2 that are adjacent to each other in a firstdirection X. The plurality of chip areas CA in the first shot area SA1may include a third chip area CA3 adjacent to the first chip area CA1 ina second direction Y. The first and second directions X and Y may beperpendicular to each other, and may be parallel to the upper surface 10s of the substrate 10.

The first chip area CA1 may include a plurality of protrusion structuresPA. For example, the first chip area CA1 may include a first protrusionstructure PA1 and a second protrusion structure PA2 that are adjacent toeach other in the first direction X. The first chip area CA1 may beformed by first and second protrusion structures PA1 and PA2 that areadjacent to each other in the first direction X, and third and fourthprotrusion structures PA3 and PA4 that are adjacent to each other in thesecond direction Y.

In some embodiments, a first distance L1 between the first protrusionstructure PA1 and the second protrusion structure PA2, adjacent to eachother in the first direction X, may be greater than a second distance L2between the first protrusion structure PA1 and the third protrusionstructure PA3, adjacent to each other in the second direction Y.

In some embodiments, a third distance L3 between the second protrusionstructure PA2 in the first chip area CA1 and a protrusion structure PA(PAS) in the second chip area CA2, adjacent to each other, may besmaller than a fourth distance L4 between first the protrusion structurePA1 in the first shot area SA1 and a protrusion structure PA (PA6) inthe second shot area SA2, adjacent to each other.

In some embodiments, the third distance L3 between the second protrusionstructure PA2 in the first chip area CA1 and the protrusion structure PA(PA5) in the second chip area CA2, adjacent to each other, may begreater than distances L1 and L2 between the protrusion structures PA1,PA2, PA3, and PA4 that are adjacent to each other in the first chip areaCA1. For example, the third distance L3 may be greater than each of thefirst distance L1 and the second distance L2.

Referring to FIGS. 1A, 2, 3, 5A, and 5B, a mask pattern 28 havingopenings 29 on the capping insulation layer 24 may be formed (S15). Themask pattern 28 may be a photoresist pattern. The openings 29 may exposethe capping insulation layer 24. The openings 29 may overlap theplanarization stop layer 20 of the protrusion structures PA. In someembodiments, each of the openings 29 may have a narrower width or asmaller size than the planarization stop layer 20.

The distances L1, L2, L3, and L4 between the protrusion structures PAadjacent to each other in the first direction X or the second directionY may be varied as described above.

The size of the openings 29 may be varied according to the distancebetween the protrusion structures PA adjacent to each other in the firstdirection X or the second direction Y. Alternatively, spacing distancesbetween conceptual lines extending from the side walls of the openings29 and the side walls of the planarization stop layer 20 in an upwarddirection, i.e., in the vertical direction Z, may be determined inaccordance with the distance between the protrusion structures PAadjacent to each other in the first direction X or the second directionY. For example, when a spacing distance between the protrusionstructures PA adjacent to each other is relatively long, a distancebetween conceptual lines extending from the side walls of the openings29 and the side surfaces of the planarization stop layer 20 in an upwarddirection Z may be relatively long. In some embodiments, when a spacingdistance between the protrusion structures PA adjacent to each other isrelatively short, a distance between conceptual lines extending from theside walls of the openings 29 and the side surfaces of the planarizationstop layer 20 in an upward direction Z may be relatively short. When aspacing distance between the protrusion structures PA adjacent to eachother is in a relatively median length, a distance between conceptuallines extending from the side walls of the openings 29 and the sidesurfaces of the planarization stop layer 20 in an upward direction Z maybe in a relatively median length.

As described above, a distance between conceptual lines extending fromthe side walls of the openings 29 and the side surfaces of theplanarization stop layer 20 in an upward direction Z may be determinedaccording to a spacing distance between the protrusion structures PAadjacent to each other.

Some embodiments in which a distance between conceptual lines extendingfrom the side walls of the openings 29 and the side surfaces of theplanarization stop layer 20 in an upward direction Z is determinedaccording to a spacing distance between the protrusion structures PAadjacent to each other will be described below.

The openings 29 may include a first opening 29 a on a planarization stoplayer 20 a of the first protrusion structure PA1 described above.

The planarization stop layer 20 a of the first protrusion structure PA1may have a first side surface 20S1 and a second side surface 20S2 facingeach other in the first direction X. The first side surface 20S1 of theplanarization stop layer 20 a of the first protrusion structure PA1 mayface the protrusion structure PA in the second shot area SA2 spacedapart from the first protrusion structure PA1 by the fourth distance L4.The second side surface 20S2 of the planarization stop layer 20 a of thefirst protrusion structure PA1 may face the second protrusion structurePA2 spaced apart from the first protrusion structure PA1 by the firstdistance L1. The first opening 29 a may have a first side wall 29S1 anda second side wall 29S2 facing each other in the first direction X. Thefirst side wall 29S1 of the first opening 29 a may be adjacent to thefirst side surface 20S1, and/or the second side wall 29S2 may beadjacent to the second side surface 20S2.

The planarization stop layer 20 a of the first protrusion structure PA1may have a third side surface 20S3 and a fourth side surface 20S4 facingeach other in the second direction Y. The third side surface 20S3 of theplanarization stop layer 20 a of the first protrusion structure PA1 mayface the protrusion structure PA in the other shot area SA spaced apartfrom the first protrusion structure PA1 by the fourth distance L4. Thefourth side surface 20S4 of the planarization stop layer 20 a of thefirst protrusion structure PA1 may face the third protrusion structurePA3 spaced apart from the first protrusion structure PA1 by the seconddistance L2.

The first opening 29 a may have a third side wall 29S3 and a fourth sidewall 29S4 facing each other in the second direction Y. In the firstopening 29 a, the third side wall 29S3 may be adjacent to the third sidesurface 20S3, and the fourth side wall 29S4 may be adjacent to thefourth side surface 20S4.

A first distance D1 between an conceptual line extending from the firstside surface 20S1 of the planarization stop layer 20 a of the firstprotrusion structure PA1 in the upward direction Z and the first sidewall 29S1 of the first opening 29 a may be different from a seconddistance D2 between an conceptual line extending from the second sidesurface 20S2 of the planarization stop layer 20 a of the firstprotrusion structure PA1 in the upward direction Z and the second sidewall 29S2 of the first opening 29 a. For example, the second distance D2may be greater than the first distance D1.

A conceptual line extending from the third side surface 20S3 of theplanarization stop layer 20 a of the first protrusion structure PA1 inthe upward direction Z and the third side wall 29S3 of the first opening29 a may be spaced apart from each other by the first distance D1.

A conceptual line extending from the fourth side surface 20S4 of theplanarization stop layer 20 a of the first protrusion structure PA1 inthe upward direction Z and the fourth side wall 29S4 of the firstopening 29 a may be spaced apart from each other by a third distance D3,greater than the second distance D2. Magnitudes of the first to thirddistances D1, D2, and D3 may be determined in accordance with apredetermined rule. Therefore, size and position of the first opening 29a may be determined. Likewise, size and position of a second opening 29b and a third opening 29 c may be determined. For example, when viewedin the first direction X, the third distance L3 between the protrusionstructure PA in the second chip area CA2 adjacent to the secondprotrusion structure PA2 and the second protrusion structure PA2 may beshorter than the fourth distance L4 between the protrusion structure PAin the second shot area SA2 adjacent to the first protrusion structurePA1 and the first protrusion structure PA1. Therefore, a width W2 of thesecond opening 29 b on the second protrusion structure PA2 in the firstdirection X may be less than a width W2 of the first opening 29 a on thefirst protrusion structure PA1 in the first direction X.

Referring to FIGS. 1A, 2, 3, 6A, and 6B, the capping insulation layer 24exposed by the openings 29 may be etched (S20). Openings 32 of thecapping insulation layer 24, corresponding to the openings 29 of themask pattern 28, may be formed by etching the capping insulation layer24. First to third openings 32 a, 32 b, and 32 c of the cappinginsulation layer 24, corresponding to the first to third openings 29 a,29 b, and 29 c of the mask pattern 28, may be formed.

In some embodiments, the planarization stop layer 20 may be exposed bythe openings 32 of the capping insulation layer 24. A portion of theprotrusion surfaces 24P of the upper surface of the capping insulationlayer 24 may remain.

In some embodiments, as the openings 32 of the capping insulation layer24 is formed, relatively shallow trenches 20 t may be formed in an upperportion of the planarization stop layers 20 adjacent to the side wallsof the openings 32.

Subsequently, the mask pattern 28 may be removed (S25).

Referring to FIGS. 1A, 2, 3, 7A, and 7B, a first planarization processfor first planarizing the capping insulation layer 24 may be performed(S30). The first planarization process may be a chemical mechanicalpolishing process. The first planarization process may lower theprotrusion surfaces 24P of FIG. 6B of the upper surface of the cappinginsulation layer 24. For example, the first planarization process maylower the protrusion surfaces 24P of the upper surface of the cappinginsulation layer 24 on a level lower than the recessed surface 24R ofFIG. 6B of the upper surface of the capping insulation layer 24.

Referring to FIG. 1A, 2, 3, 8A, and 8B, a second planarization processfor second planarizing the capping insulation layer 24 may be performed(S35). The second planarization process may be a chemical mechanicalpolishing process. The second planarization process may lower therecessed surface 24R of FIG. 6B of the upper surface of the cappinginsulation layer 24. For example, the second planarization process maylower the recessed surface 24R of FIG. 6B of the upper surface of thecapping insulation layer 24, and remove a portion of the cappinginsulation layer 24 remaining on the upper surface of the planarizationstop layer 20 at the same time. Therefore, the capping insulation layer24 may be planarized.

The capping insulation layer 24 may have upper end portions 24T adjacentto the protrusion structures PA.

As illustrated in the cross-sectional view of FIG. 8A, in the firstdirection X, the upper end portions 24T of the capping insulation layer24 may have a first upper end portion 24T1 and a second upper endportion 24T2, adjacent to a first upper insulation layer 18 a of thefirst protrusion structure PA1, and are opposite to each other, and athird upper end portion 24T3 and a fourth upper end portion 24T4,adjacent to a second upper insulation layer 18 b of the secondprotrusion structure PA2, and are opposite to each other. The secondupper end portion 24T2 and the third upper end portion 24T3 may faceeach other.

In some embodiments, the second upper end portion 24T2 and the thirdupper end portion 24T3, which may face each other, may be positioned onthe same or similar height level with respect to each other.

In some embodiments, the first upper end portion 24T1 may be positionedon a level higher than that of the second upper end portion 24T2. Thefourth upper end portion 24T4 may be positioned on a level higher thanthat of the third upper end portion 24T3. The fourth upper end portion24T4 may be positioned on a lower level than the first upper end portion24T1.

Therefore, in the first to fourth upper end portions 24T1, 24T2, 24T3,and 24T4, the first upper end portion 24T1 may be positioned on arelatively high level, the second and third upper end portions 24T2 and24T3 may be positioned on a relatively low level, and the fourth upperend portion 24T4 may be positioned on a relatively intermediate level.

As illustrated in the cross-sectional view of FIG. 8A, in the seconddirection Y, the upper end portions 24T of the capping insulation layer24 may have a fifth upper end portion 24T5 and a sixth upper end portion24T6, adjacent to the first upper insulation layer 18 a of the firstprotrusion structure PA1, and are opposed to each other, and a seventhupper end portion 24T7 and an eighth upper end portion 24T8, adjacent toa third upper insulation layer 18 c of the third protrusion structurePA3, and are opposite to each other. The sixth upper end portion 24T6and the seventh upper end portion 24T7 may face each other.

In some embodiments, the sixth upper end portion 24T6 and the seventhupper end portion 24T7, which may face each other, may be positioned onthe same height level with respect to each other.

In some embodiments, the fifth upper end portion 24T5 may be positionedon a level higher than that of the sixth upper end portion 24T6, theseventh upper end portion 24T7, and the eighth upper end portion 24T8.The eighth upper end portion 24T8 may be positioned on a level higherthan that of the seventh upper end portion 24T7.

Therefore, in the fifth to eighth upper end portions 24T5, 24T6, 24T7,and 24T8, the fifth upper end portion 24T5 may be positioned on arelatively high level, the sixth and seventh upper end portions 24T6 and24T7 may be positioned on a relatively low level, and the eighth upperend portion 24T8 may be positioned on a relatively intermediate level.

In some embodiments, the first and fifth upper end portions 24T1 and24T5 positioned in different shot areas and facing each other may bepositioned on a level higher than that of the other upper end portions24T2, 24T3, 24T4, 24T6, and 26T7 positioned in any one shot area. Thefourth and eighth upper end portions 24T4 and 24T8 facing the other chipregions in any one shot area may be positioned on a lower level than thefirst and fifth upper end portions 24T1 and 24T5. The sixth and seventhupper end portions 24T6 and 24T7 having a relatively short distancefacing each other in any one chip area may be positioned on a lowerlevel than the second and third upper end portions 24T2 and 24T3 havinga relatively long distance facing each other.

In some embodiments, the first to fourth upper end portions 24T1, 24T2,24T3, and 24T4 and the fifth to eighth upper end portions 24T5, 24T6,24T7, and 24T8 may be positioned on a level higher than that of theupper insulation layer 18, but the present inventive concepts are notlimited thereto. At least one upper end portion positioned on arelatively low level among the first to fourth upper end portions 24T1,24T2, 24T3, and 24T4 and the fifth to eighth upper end portions 24T5,24T6, 24T7, and 24T8 may be positioned on a lower level than the uppersurface of the upper insulation layer 18. Such modified embodiments willbe described with reference to FIG. 9. FIG. 9 is a partially enlargedcross-sectional view illustrating some embodiments in which the heightlevel of the second upper end portion 24T2 may vary.

Referring to FIG. 9, the second upper end portion (24T2 in FIG. 8A)positioned on a level higher than that of the upper surface of the upperinsulation layer 18 may be modified as a further second upper endportion (24T2′ in FIG. 9) positioned on a lower level than the uppersurface of the upper insulation layer 18. As described above,positioning at least one upper end positioned on a relatively low levelon a lower level than the upper surface of the upper insulation layer 18may occur by performing an over-planarization process, such that, whenthe second planarization process may be performed in S35 to secondplanarize the capping insulation layer 24, the capping insulation layer24 on the upper surface of the planarization stop layer 20 may notremain, resulting in further second upper end portion 24T2′ being on alower level than the upper surface of the upper insulation layer 18.

Referring to FIGS. 1A, 2, 3, 10A, and 10B, the planarization stop layer20 of FIG. 8B may be removed (S40). Therefore, the upper insulationlayers 18 may be exposed.

A surface of the capping insulation layer 24 may be hardened to form asurface layer 24H. For example, the surface layer 24H may be formed byhardening the surface of the capping insulation layer 24 using anannealing process that may be carried out in a wet atmosphere at aprocess temperature of about 500° C. to about 1000° C., and for aprocess time of about 30 minutes to about 2 hours. The surface layer 24Hmay be seen as a linear shape, when observed using equipment such as ascanning electron microscope or the like.

The surface of the upper insulation layer 18, which may be formed with amore dense oxide than the capping insulation layer 24, may not behardened by the annealing process, or may be hardened to have athickness that is thinner than the surface layer 24H of the cappinginsulation layer 24. In some embodiments, the surface layer 24H of thecapping insulation layer 24 may separate the capping insulation layer 24and the upper insulation layer 18.

The surface layer 24H may be formed by hardening the surface of thecapping insulation layer 24, which may be formed of a less dense oxideor a relatively porous oxide, e.g., a low-k dielectric. The surfacelayer 24H may protect the capping insulation layer 24 from subsequentprocesses.

Referring to FIG. 1B, a memory structure may then be formed (S45). Amethod of forming such a memory structure will be described.

Referring to FIG. 1B, 2, 3, 11A, and 11B, a first insulation layer 36may be formed on the capping insulation layer 24. Memory verticalstructures 40 passing through the central region CR of the protrusionstructures PA may be formed on the substrate 10.

Referring to FIG. 1B, 2, 3, 12A, and 12B, a second insulation layer 56covering the first insulation layer 36 and the memory verticalstructures 40 may be formed. The first and second insulation layers 36and 56 may be formed of silicon oxide.

Separation trenches 57 passing through the protrusion structures PA maybe formed on the substrate 10. The separation trenches 57 may passthrough the protrusion structures PA and extend in an upward direction,and may pass through the upper insulation layer 18, the cappinginsulation layer 24, and the first and second insulation layers 36 and56, which overlap the protrusion structures PA.

The gate layers 16 may be exposed by the separation trenches 57.

Referring to FIGS. 1B, 2, 3, 13A, and 13B, the gate layers 16 exposed bythe separation trenches 57 may be replaced with gate patterns 60.Subsequently, separation structures 66 filling the separation trenches57 may be formed.

Therefore, the above-described protrusion structures PA may be modifiedinto protrusion structures PA′ in which the gate layers 16 are replacedwith the gate patterns 60. The protrusion structures PA′, which may bemodified as above, may include first to third protrusion structuresPA1′, PA2′, and PA3′, which may be modified at positions correspondingto the first to third protrusion structures PA1, PA2, and PA3 asdescribed above. Likewise, the molded structures 12 may be replaced bystacked structures 72. Therefore, the stacked structure 72 may includethe interlayer insulation layers 14 and the gate patterns 60, which arealternately and repeatedly stacked.

In some embodiments, the gate layers 16 may remain in a portion of thestepped region SR positioned in the width direction of the separationstructures 66, e.g., in the second direction Y. Therefore, each of thestacked structures 72 may include the gate layers 16 remaining in aportion of the stepped region SR positioned in the width direction ofthe separation structures 66, e.g., in the second direction Y, andfacing the gate patterns 60.

The plan view of the separation structures 66 will be described withreference to FIG. 14. FIG. 14 is a plan view schematically illustratingthe separation structures 66 and the memory vertical structures 40together with any one of the protrusion structures PA′.

Referring to FIG. 14, the separation structures 66 may traverse theprotrusion structure PA′. The memory vertical structures 40 may beformed in the central region CR of the protrusion structure PA′, and maybe formed between the separation structures 66.

Next, referring to FIG. 1B, 2, 3, 15A, and 15B, a wiring structure maybe formed (S50). Formation of the wiring structure may include forming athird insulation layer 74 on the second insulation layer 56, forminggate contact structures 80 electrically connected to the gate patterns60 having a stepped structure in the stepped region SR positioned in thefirst direction X, forming bit line contact structures 82 electricallyconnected to the memory vertical structures 40, and forming wiring lines84 and 86 on the third insulation layer 74. The wiring lines 84 and 86may include gate connection wiring lines 84 electrically connected tothe gate contact structures 80, and bit lines 86 electrically connectedto the bit line contact structures 82. Then, an upper capping insulationlayer 90 covering the wiring lines 84 and 86 may be formed on the thirdinsulation layer 74.

Some embodiments of the above-described methods of forming the memoryvertical structures 40, the gate patterns 60, and the separationstructures 66 will be described with reference to FIGS. 16 and 17. FIG.16 is a partially enlarged cross-sectional view illustrating a regionincluding any one of the memory vertical structures 40, and FIG. 17 is apartially enlarged cross-sectional view illustrating a region includingany one of the separation structures 66.

Some embodiments of a method of forming any one of the memory verticalstructures 40, the gate patterns 60, and any one of the separationstructures 66 will be described with reference to FIGS. 11A to 17.

Referring to FIGS. 11A to 17, the memory vertical structure 40 may beformed to include a dielectric structure 44 and a channel semiconductorlayer 52. For example, as described in FIGS. 11A and 11B, a formation ofthe memory vertical structure 40 may include: forming a channel holepassing through the central region CR of the protrusion structure PA andexposing the substrate 10, performing an epitaxial process to form asemiconductor pattern 42 filling a lower region of the channel hole 40Hof the substrate 10 exposed by the channel hole 40H, forming adielectric structure 44 on the side wall of the channel hole 40H,forming a channel semiconductor layer 52 in contact with thesemiconductor pattern 42 while covering an inner wall of the dielectricstructure 44, forming a core pattern 53 partially filling the channelhole 40H, and forming a pad pattern 54 filling remaining portion of thechannel hole 40H. The pad pattern 54 may be formed on the core pattern53 and in contact with the channel semiconductor layer 52.

The channel semiconductor layer 52 may be formed of polysilicon. Thecore pattern 53 may be formed of an insulating material such as siliconoxide. The pad pattern 54 may be formed of a doped polysilicon, e.g.,polysilicon having N-type conductivity.

The dielectric structure 44 may include a tunnel insulation layer 50, adata storage layer 48, and a blocking insulation layer 46. The datastorage layer 48 may be disposed between the tunnel insulation layer 50and the blocking insulation layer 46. The tunnel insulation layer 50 maybe disposed between the channel semiconductor layer 52 and the datastorage layer 48. The blocking insulation layer 46 may be disposedbetween the data storage layer 48 and the gate patterns 60. The tunnelinsulation layer 50 may include silicon oxide and/or impurity dopedsilicon oxide. The blocking insulation layer 46 may include siliconoxide and/or a high-k dielectric.

The data storage layer 48 may store data in a non-volatile memory devicesuch as a flash memory device or the like. For example, the data storagelayer 48 may be formed of a material, e.g., silicon nitride, which maytrap and retain electrons injected from the channel semiconductor layer52 through the tunnel insulation layer 50, or erase the trappedelectrons in the data storage layer 48, according to operatingconditions of a non-volatile memory device such as a flash memorydevice.

As described in FIGS. 12A and 12B, the formation of the gate patterns 60may include forming the separation trenches 57 to expose the gate layers(16 in FIGS. 12A and 12B), etching the exposed gate layers (16 in FIGS.12A and 12B) to form void spaces exposing the side surfaces of thememory vertical structures 40, forming a first material layer 62covering and/or in contact with the inner walls of the void spaces, anda second material layer 64 filling the void spaces, and removing thefirst and second material layers 62 and 64 remaining in the separationtrenches 57. The first material layer 62 may cover and/or be in contactwith upper and lower surfaces of the second material layer 64, and mayextend between the second material layer 64 and the memory verticalstructure 40.

In some embodiments, the first material layer 62 may be formed of adielectric, e.g., a high-dielectric such as aluminum oxide, and thesecond material layer 64 may be formed of a conductive material, e.g.,any one of doped polysilicon, a metal nitride (e.g., TiN, or the like),or a metal (e.g., W), or a combination thereof.

In some embodiments, the first material layer 62 and the second materiallayer 64 may be formed of different conductive materials. For example,the first material layer 62 may be formed of a metal nitride (e.g.,TiN), and the second material layer 64 may be formed of a metal (e.g.,W).

The gate patterns 60 may include a lower gate pattern 60L, intermediategate patterns 60M on the lower gate pattern 60L, and an upper gatepattern 60U on the intermediate gate patterns 60M.

In some embodiments, the second material layer 64 of the lower gatepattern 60L may be a ground selection line of a NAND flash memorydevice, and the second material layers 64 of the intermediate gatepatterns 60M may be word lines of a NAND flash memory device, and thesecond material layer 64 of the upper gate pattern 60U may be a stringselection line of a NAND flash memory device.

The data storage layer 48 may store data in a region facing theintermediate gate patterns 60M, which may be word lines. Regions capableof storing data in the data storage layers 48 in the memory verticalstructures 40 may be arranged in a direction Z perpendicular to theupper surface of the substrate 10, and may include the memory cells.

The memory vertical structures 40 and the gate patterns 60 may be amemory structure in S45 of FIG. 1B.

After forming the gate patterns 60, the separation structures 66 may beformed to fill the separation trenches (57 in FIGS. 12A and 12B). Eachof the separation structures 66 may include separation spacers 68covering the side surfaces of each of the separation trenches 57 andseparation core pattern 70 filling each of the separation trenches 57.In some embodiments, the separation spacer 68 may be formed of aninsulating material such as silicon oxide or the like, and theseparation core pattern 70 may be formed of any one of a dopedpolysilicon, a metal nitride (e.g., TiN, etc.), a metal (e.g., W), or acombination thereof.

In some embodiments, the separation spacer 68 and the separation corepattern 70 may be formed of insulating materials.

The second upper end portion 24T2′, which may be modified, may bepositioned on a lower level than the upper surface of the upperinsulation layer 18, as described above with reference to FIG. 9. Asdescribed above, a semiconductor process may be performed by the methoddescribed with reference to FIGS. 10A to 17 with regard to the substratehaving the second upper end portion 24T2′, which may be modified, toform a semiconductor device having the second upper end portion 24T2′positioned on a lower level than the upper surface of the upperinsulation layer 18 as illustrated in FIG. 18. The third upper endportion 24T3′ may be positioned on the same height level as the secondupper end portion 24T2′ as described above, and, thus, may be positionedon a lower height level than the upper surface of the upper insulationlayer 18.

Referring to FIGS. 1B, 2, 3, and 19, a semiconductor chip CH may beseparated (S55). The separation of the semiconductor chip CH may includecutting the chip areas CA to separate the chip areas CA from each other,as illustrated in FIG. 2. Each of the chip areas CA thus separated maybe the semiconductor chip CH. Therefore, the semiconductor chip CH mayinclude the protrusion structures PA′ formed on the substrate 10. Eachof the protrusion structures PA′ may include a central region CR, and astepped region SR of a stepped structure surrounding the central regionCR.

A product 100 may be formed using the semiconductor chip CH (S60). Theproduct 100 may include the semiconductor chip CH disposed on a base 95.In some embodiments, when the product 100 is a semiconductor device suchas a semiconductor package, the base 95 may be a printed circuit board.In another embodiment, the product 100 may be an electronic devicecomprising a semiconductor device including the semiconductor chip CH.

Therefore, a semiconductor device formed by the method for forming asemiconductor device, as described with reference to FIGS. 1A to 19, maybe provided. A structure of the semiconductor device formed by theabove-described method will be described with reference to FIGS. 15A,15B, 16, 17, and 19 again. In explaining the structure of such asemiconductor device, contents overlapping those described above withreference to FIGS. 1A to 19 or the contents capable of being recognizedfrom the contents described with reference to FIGS. 1A to 19 will beomitted.

Referring to FIGS. 14, 15A, 15B, 16, 17 and 19, protrusion structuresPA′ may be disposed on a substrate 10. Each of the protrusion structuresPA′ may include a stacked structure 72, and an upper insulation layer 18on the stacked structure 72.

Each of the protrusion structures PA′ may include a central region CR,and a stepped region SR surrounding the central region CR. Each of thestacked structures 72 may be viewed as including the central region CR,and the stepped region SR surrounding the central region CR, in asimilar manner to the protrusion structures PA′.

Each of the stacked structures 72 may include interlayer insulationlayers 14 and gate patterns 60, which are alternately and repeatedlystacked in the central region CR and extend into the stepped region SRto form a stepped structure in the stepped region SR. The interlayerinsulation layers 14 and the gate patterns 60 may have a steppedstructure in the stepped regions SR. The upper insulation layer 18 ofthe protrusion structures PA′ may be positioned in the central regionCR, and may be disposed on the stacked structures 72.

A capping insulation layer 24 may surround the upper insulation layer18, cover the stepped regions SR of the stacked structures 72, and fillbetween the stacked structures 72.

The capping insulation layer 24 may include a surface layer 24H formedin a surface of the capping insulation layer 24. The surface layer 24Hmay be formed by hardening the surface of the capping insulation layer24, and, thus, may be harder and/or denser than other portion of thecapping insulation layer 24. The other portion of the capping insulationlayer 24 may be referred to as a ‘main portion’. Accordingly, thesurface layer 24H of the capping insulation layer 24 may be disposed onan upper surface of the main portion of the capping insulation layer 24.

The capping insulation layer 24 may include upper end portions 24Tadjacent to the upper insulation layer 18 and positioned on differentheight levels.

The capping insulation layer 24 may include portions increasing inheight in a direction Z perpendicular to the upper surface 10 s of thesubstrate 10, as the upper insulation layer 18 are closer to the cappinginsulation layer 24. For example, the upper end portions 24T of thecapping insulation layer 24 may be upper end portions of portionsincreasing in height in a direction Z perpendicular to the upper surface10 s of the substrate 10, as they are closer to the upper insulationlayer 18. For example, the capping insulation layer 24 may include anupper surface 24U, inclined surfaces 24I and the upper end portions 24T.The heights of the upper end portions 24T of the capping insulationlayer 24 may be higher than a height relative to the substrate 10 of theupper surface 24U of the capping insulation layer 24. The inclinedsurfaces 24I of the capping insulating layer 24 may extend from theupper surface 24U of the capping insulation layer 24 to the upper endportions 24T of the capping insulation layer 24.

The stacked structures 72 may include a first stacked structure 72 a anda second stacked structure 72 b, adjacent to each other in the firstdirection X. The upper insulation layer 18 may include a first upperinsulation layer 18 a overlapping the central region CR of the firststacked structure 72 a and a second upper insulation layer 18 boverlapping the central region CR of the second stacked structure 72 b.

The upper end portions 24T of the capping insulation layer 24 mayinclude a first upper end portion 24T1 and a second upper end portion24T2, adjacent to the first upper insulation layer 18 a. The first upperinsulation layer 18 a may be positioned between the first upper endportion 24T1 and the second upper end portion 24T2.

The second upper end portion 24T2 may be positioned between the firstupper insulation layer 18 a and the second upper insulation layer 18 b,and may be adjacent to the first upper insulation layer 18 a. A heightlevel of the second upper end portion 24T2 may be lower than a heightlevel of the first upper end portion 24T1.

The capping insulation layer 24 may further include a third upper endportion 24T3 and a fourth upper end portion 24T4, adjacent to the secondupper insulation layer 18 b. The second upper insulation layer 18 b maybe positioned between the third upper end portion 24T3 and the fourthupper end portion 24T4, and the third upper end portion 24T3 may bepositioned between the first upper insulation layer 18 a and the secondupper insulation layer 18 b, and may be adjacent to the second upperinsulation layer 18 b. A height of the third upper end portion 24T3 anda height of the fourth upper end portion 24T4 may be different from eachother. The second upper end portion 24T2 and the third upper end portion24T3 may face each other, and may be positioned on substantially thesame height with respect to each other. The fourth upper end portion24T4 may be positioned on a height that is higher than the second andthird upper end portions 24T2 and 24T3, and may be positioned on a lowerheight than the first upper end portion 24T1.

Memory vertical structures 40 may extend in a vertical direction Zperpendicular to an upper surface 10 s of the substrate 10 and have sidesurfaces facing the gate patterns 60 in the central regions CR of thestacked structures 72 of the protrusion structure PA′. Since the memoryvertical structures 40 have been described above in the forming method,a detailed description thereof will be omitted.

Separation structures 66 may extend in a direction Z perpendicular tothe upper surface 10 s of the substrate 10. The separation structures 66may pass through the protrusion structures PA′. Each of the protrusionstructures PA′ located between the separation structures 66 may includethe central region CR between the stepped regions SR spaced apart fromeach other. The stacked structure 72 and the upper insulation layer 18of the protrusion structure PA′ may be positioned between the separationstructures 66.

In some embodiments, the upper end portions 24T may be positioned on alevel higher than that of the upper surface of the upper insulationlayer 18, but the present inventive concepts are not limited thereto.Referring to FIG. 18, one of the upper end portions 24T may bepositioned on a level higher than that of the upper surface of the upperinsulation layer 18, and the other may be positioned on a lower levelthan the upper surface of the upper insulation layer 18. In the upperend portions 24T, the second and third upper end portions 24T2 and 24T3may be positioned on a lower level than the upper surface of the upperinsulation layer 18, and the first and fourth end portions 24T1 and 24T4may be positioned on a level higher than that of the upper surface ofthe upper insulation layer 18.

The degree of planarization of the capping insulation layer 24 may beimproved by planarization of the capping insulation layer 24 using themethods described above. For example, in the capping insulation layer24, the degree of planarization in a portion apart from the protrusionstructures PA may be improved. Therefore, the overall degree ofplanarization of the planarized capping insulation layer 24 may beimproved. A subsequent photolithography process using a substrateincluding the capping insulation layer 24 to improve the degree ofplanarization, e.g., a photolithography process for forming the channelholes filled in the memory vertical structures 40 (40H in FIG. 16) or aphotolithography process for forming the separation trenches 57 mayproceed without defects or with minimal defects.

As described above, since the degree of planarization of the cappinginsulation layer 24 may be improved, the number of stacked gate patterns60 in the protrusion structure PA′ may be increased to improve thedegree of integration of semiconductor devices. For example, even when aheight difference between an upper surface and a lower surface of theprotrusion structure PA′ is increased by increasing the number ofstacked gate patterns 60 in the protrusion structure PA′, semiconductordevices minimized defects may be formed by providing a method ofplanarizing the capping insulation layer 24. Therefore, the degree ofintegration of semiconductor devices, yield, and productivity in themanufacturing of semiconductor devices may be improved.

According to some embodiments of the present inventive concepts, amethod of forming semiconductor devices may improve the degree ofplanarization of a capping insulation layer filling between stackedstructures. When the method is used, the degree of integration ofsemiconductor devices may be improved, and productivity in themanufacturing of semiconductor devices may be improved.

While example embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinventive concepts as defined by the appended claims.

What is claimed is:
 1. A method for forming a semiconductor devicecomprising: forming protrusion structures on a substrate, wherein eachof the protrusion structures comprises a molded structure, an upperinsulation layer on the molded structure, and a planarization stop layeron the upper insulation layer; forming a capping insulation layer on thesubstrate having the protrusion structures; forming a mask patternhaving openings on the capping insulation layer, wherein the openingsoverlap the protrusion structures; etching the capping insulation layerexposed by the openings; removing the mask pattern after etching thecapping insulation layer; performing a first planarization process forfirst planarizing the capping insulation layer, after the mask patternis removed; performing a second planarization process for secondplanarizing the capping insulation layer to form a planarized cappinginsulation layer, after the first planarization process; and removingplanarization stop layers of the protrusion structures to expose theupper insulation layers, wherein the planarized capping insulation layerhas upper end portions adjacent to the planarization stop layers, andwherein the upper end portions comprise first and second upper endportions positioned at different height levels.
 2. The method accordingto claim 1, wherein the planarized capping insulation layer comprisesprotrusion regions of increasing height protruding in a directionperpendicular to an upper surface of the substrate as the planarizedcapping insulation layer is closer to the upper insulation layers, andwherein the upper end portions of the planarized capping insulationlayer are upper end portions of the protrusion regions.
 3. The methodaccording to claim 1, further comprising: hardening a surface of theplanarized capping insulation layer to form a surface layer within asurface of the planarized capping insulation layer.
 4. The methodaccording to claim 1, further comprising: forming memory verticalstructures passing through the upper insulation layer and the moldedstructures, wherein each of the molded structures of the protrusionstructures comprises interlayer insulation layers and gate layers thatare alternately and repeatedly stacked, and wherein the memory verticalstructures have side surfaces facing the gate layers.
 5. The methodaccording to claim 4, further comprising: forming separation trenchesthat pass through the protrusion structures and exposing the gatelayers; replacing the gate layers exposed by the separation trencheswith gate patterns; and forming separation structures within theseparation trenches.
 6. A method for forming a semiconductor devicecomprising: forming protrusion structures on a substrate, wherein eachof the protrusion structures comprises a molded structure comprising acentral region and a stepped region surrounding the central region, anupper insulation layer on the central region of the molded structure,and a planarization stop layer on the upper insulation layer; forming acapping insulation layer on the substrate having the protrusionstructures; forming a mask pattern having openings on the cappinginsulation layer, wherein the openings overlap the central regions ofthe protrusion structures; etching the capping insulation layer exposedby the openings; removing the mask pattern after etching the cappinginsulation layer; performing a first planarization process for firstplanarizing the capping insulation layer, after the mask pattern isremoved; performing a second planarization process for secondplanarizing the capping insulation layer to form a planarized cappinginsulation layer, after the first planarization process; and removingthe planarization stop layers of the protrusion structures to expose theupper insulation layers, wherein the openings have a smaller size thanthe planarization stop layers of the protrusion structures, and whereinthe openings comprise openings having different widths or sizes fromeach other.
 7. The method according to claim 6, wherein in one firstprotrusion structure among the protrusion structures, and in a firstopening on the planarization stop layer of the first protrusionstructure among the openings, the planarization stop layer of the firstprotrusion structure has a first side surface and a second side surface,wherein the first opening has a first side wall adjacent to the firstside surface and a second side wall adjacent the second side surface,and wherein a distance between an conceptual line extending from thefirst side surface of the planarization stop layer in an upwarddirection and the first side wall of the first opening is different froma distance between an conceptual line extending from the second sidesurface of the planarization stop layer in an upward direction and thesecond side wall of the first opening.
 8. The method according to claim7, wherein, in the first protrusion structure, a distance between anconceptual line extending from the first side surface of theplanarization stop layer in an upward direction and the first side wallof the first opening is shorter than a distance between an conceptualline extending from the second side surface of the planarization stoplayer in an upward direction and the second side wall of the firstopening.
 9. The method according to claim 8, wherein the protrusionstructures comprise a second protrusion structure facing the first sidesurface of the first protrusion structure and spaced apart from thefirst protrusion structure by a first distance, and a third protrusionstructure facing the second side of the first protrusion structure andspaced apart from the first protrusion structure by a second distanceshorter than the first distance.
 10. The method according to claim 6,wherein distances between side walls of the openings and conceptuallines extending from side surfaces of the planarization stop layer in anupward direction are determined according to a distance betweenneighboring protrusion structures.
 11. The method according to claim 6,further comprising: hardening a surface of the planarized cappinginsulation layer to form a surface layer within the surface of theplanarized capping insulation layer.
 12. The method according to claim6, further comprising: forming memory vertical structures passingthrough the upper insulation layer and the molded structures, whereineach of the molded structures of the protrusion structures comprisesinterlayer insulation layers and gate layers which are alternately andrepeatedly stacked, and wherein the memory vertical structures have sidesurfaces facing the gate layers.
 13. The method according to claim 12,further comprising: forming separation trenches passing through theprotrusion structures and exposing the gate layers; replacing the gatelayers exposed by the separation trenches with gate patterns; andforming separation structures within the separation trenches.
 14. Amethod for forming a semiconductor device comprising: forming first andsecond protrusion structures on a substrate, wherein the firstprotrusion structure comprises a first molded structure comprising afirst central region and a first stepped region adjacent to the firstcentral region, a first upper insulation layer on the first centralregion, and a first planarization stop layer on the first upperinsulation layer, and wherein the second protrusion structure comprisesa second molded structure comprising a second central region and asecond stepped region adjacent to the second central region, a secondupper insulation layer on the second central region, and a secondplanarization stop layer on the second upper insulation layer; forming acapping insulation layer on the substrate having the first and secondprotrusion structures, wherein the capping insulation layer overlaps thefirst and second planarization stop layers; forming a mask patternhaving first and second openings on the capping insulation layer,wherein the first opening overlap the first central region of the firstprotrusion structure, and wherein the second opening overlap the secondcentral region of the second protrusion structure; etching the cappinginsulation layer exposed by the first and second openings of the maskpattern; removing the mask pattern after etching the capping insulationlayer; and performing a planarization process for planarizing thecapping insulation layer after the mask pattern is removed, wherein awidth of the first opening is different from a width of the secondopening.
 15. The method according to claim 14, wherein a size of thefirst protrusion structure is substantially the same as a size of thesecond protrusion structure.
 16. The method according to claim 14,wherein a width of the first planarization stop layer is greater than awidth of the first opening, and wherein a width of the secondplanarization stop layer is greater than a width of the second opening.17. The method according to claim 14, further comprising: hardening asurface of the planarized capping insulation layer to form a surfacelayer within the surface of the planarized capping insulation layer. 18.The method according to claim 14, further comprising: forming memoryvertical structures, wherein each of the first and second moldedstructures comprise interlayer insulation layers and gate layers, whichare alternately and repeatedly stacked, and wherein the memory verticalstructures comprise a first memory vertical structure passing throughthe first upper insulation layer and the first molded structures, and asecond memory vertical structure passing through the second upperinsulation layer and the second molded structure.
 19. The methodaccording to claim 18, further comprising: forming separation trenches,wherein the separation trenches comprise a first separation trenchpassing through the first protrusion structure and exposing the gatelayers of the first protrusion structure, and a second separation trenchpassing through the second protrusion structure and exposing the gatelayers of the second protrusion structure; replacing the gate layersexposed by the separation trenches with gate patterns; and formingseparation structures within the separation trenches.
 20. The methodaccording to claim 19, further comprising: forming gate contact plugspassing through the planarized capping insulation layer and contactinggate pads of the gate patterns in the first and second stepped regions.